Lectrosonics L1-BK-LMO-DS-K

Lectrosonics L1-BK-LMO-DS-K Sonaura Lavalier Kit

The Lectrosonics L1-BK-LMO-DS-K is a black omnidirectional sub-miniature lavalier microphone with a Sonaura MEMS capsule and a Lemo connector for the Lectrosonics DSSM. This Kit version includes the microphone, two acoustic caps, a lapel clip with rotating clasp, a windscreen and a moulded storage box with a transparent lid.

This version is compatible exclusively with the Lectrosonics DSSM. It does not work with the SSM or with other Lemo-terminated transmitters.

The Sonaura capsule uses silicon-based micro-electro-mechanical structures with an encapsulated diaphragm. Lectrosonics specifies unit-to-unit matching within 0.5 dB for sensitivity and frequency response. This limits differences between individual microphones when several L1 units are used together.

The L1 combines 11 dB(A) self-noise with a signal-to-noise ratio greater than 83 dB. Sensitivity can be adjusted through the DSSM menu for quiet or louder sources. The manufacturer specifies a maximum sound pressure level of 135 dB SPL peak. High or low sensitivity is selected in the transmitter without replacing the microphone.

The supplied acoustic caps allow the high-frequency response to be adjusted. The standard cap provides a 3 dB boost between 8 and 20 kHz. The High Boost cap provides a 9 dB boost between 12 and 14 kHz. The lapel clip with rotating clasp provides adjustable attachment to clothing, while the supplied windscreen and storage box complete the Kit for use and transport.

The watertight construction combines the MEMS capsule with a hydrophobic internal coating and 0.4 mm laser-drilled cap ports. According to Lectrosonics, the microphone remains functional when fully submerged. The microphone has a 5.4 mm diameter. Its flexible cable is Kevlar-reinforced and features identification rings at the connector.

Expected delivery: fourth quarter of 2026, according to the manufacturer. This is an estimated schedule, not a confirmed delivery date.

Main Features

• Omnidirectional sub-miniature lavalier microphone with Sonaura MEMS capsule
• Black version with DSSM-specific Lemo connection
• High and low sensitivity selectable through the DSSM
• Low self-noise for recording quiet sources
• Unit-to-unit sensitivity and frequency-response matching within 0.5 dB, as specified by the manufacturer
• Watertight construction with a hydrophobic internal coating
• Standard and High Boost acoustic caps for different high-frequency responses
• Flexible Kevlar-reinforced cable with identification rings at the connector
• Kit with lapel clip, windscreen and storage box with transparent lid

Specifications

• Microphone type: sub-miniature lavalier microphone
• Capsule technology: Sonaura MEMS
• Polar pattern: omnidirectional
• Frequency response: 20 Hz – 20 kHz
• Sensitivity: -34 dBV ±1 dB; -54 dBV in low-sensitivity mode
• Equivalent noise: 11 dB SPL, A-weighted
• Signal-to-noise ratio: >83 dB
• Maximum sound pressure level: 135 dB SPL peak
• Standard cap: +3 dB from 8 to 20 kHz
• High Boost cap: +9 dB from 12 to 14 kHz
• Nominal operating voltage: 4.0 V
• Microphone diameter: 5.4 mm
• Cable: flexible, Kevlar-reinforced
• Connector: Lemo, DSSM-specific dual-sensitivity version
• Colour: black

Included

• L1 lavalier microphone, black, with cable and Lemo connector for DSSM
• Standard acoustic cap
• Additional High Boost cap
• Lapel clip with rotating clasp
• Windscreen
• Moulded storage box with transparent lid

Compatibility

This version is suitable for the Lectrosonics DSSM/E01-A1B1 and DSSM/E01-B1C1. The transmitter is sold separately. It is not compatible with the SSM or other Lemo-terminated transmitters, even if the connector appears to fit mechanically.

In the DSSM InpCfg menu, select L1 Hsns for high sensitivity or L1 Lsns for low sensitivity. These settings were introduced with firmware 3.09 (SUPER) / 2.01 (FPGA). A DSSM running older firmware must be updated to provide these settings.

Other Version

The Lectrosonics L1-BK-LMO-DS-N Naked includes the same microphone with its standard cap and additional High Boost cap, but comes in a small cardboard box without a lapel clip, windscreen or storage box. Microphone specifications and DSSM compatibility are identical.